Author Info
Name
Affiliation
Papers
XAVIER BARATON
ST Microelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore
3
Collaborators
Citations 
PageRank 
9
16
10.91
Referers 
Referees 
References 
46
9
2
Title
Citations
PageRank
Year
Interface delamination analysis of TQFP package during solder reflow10.372010
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications129.312003
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill31.232003