Author Info
Name
Affiliation
Papers
DANIEL YAP
STMicroelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521, Singapore
3
Collaborators
Citations 
PageRank 
6
21
12.38
Referers 
Referees 
References 
53
0
0
Title
Citations
PageRank
Year
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications129.312003
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill31.232003
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages61.842003