Author Info
Name
Affiliation
Papers
RYAN S. H. YANG
Electronic and Ultrasonic Engineering Group, General Engineering Research Institute, Liverpool John Moores University, UK
1
Collaborators
Citations 
PageRank 
3
3
0.54
Referers 
Referees 
References 
17
2
1
Title
Citations
PageRank
Year
An automated ultrasonic inspection approach for flip chip solder joint assessment.30.542012