Author Info
Name
Affiliation
Papers
DAE WOOK YANG
STATS ChipPAC Korea Ltd, Ichon 467701, South Korea
1
Collaborators
Citations 
PageRank 
4
3
0.41
Referers 
Referees 
References 
13
20
1
Title
Citations
PageRank
Year
3D TSV processes and its assembly/packaging technology30.412009