Author Info
Name
Affiliation
Papers
SEUNG WOOK YOON
STATS ChipPAC Ltd, 5 Yishun St 23, Singapore 768442, Singapore
2
Collaborators
Citations 
PageRank 
7
4
0.80
Referers 
Referees 
References 
18
20
2
Title
Citations
PageRank
Year
Fabrication And Packagig Of Microbump Interconnections For 3d Tsv10.392009
3D TSV processes and its assembly/packaging technology30.412009