Author Info
Name
Affiliation
Papers
WILLIAM D. BROWN
Department of Electrical Engineering, High Density Electronics Center (HiDEC), University of Arkansas, Fayetteville, AR 72701, USA
3
Collaborators
Citations 
PageRank 
9
4
2.98
Referers 
Referees 
References 
14
0
0
Title
Citations
PageRank
Year
Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems21.962004
Investigation of reliability issues in high power laser diode bar packages20.682003
CVD-diamond substrates for multi-chip modules (MCMs)00.341995