| Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material. | 1 | 0.36 | 2019 |
| Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System. | 0 | 0.34 | 2019 |
| Miniaturized and high-performance RF packages with ultra-thin glass substrates. | 0 | 0.34 | 2018 |
| High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications. | 0 | 0.34 | 2018 |
| EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field. | 3 | 0.42 | 2018 |
| TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC | 0 | 0.34 | 2015 |
| Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC | 0 | 0.34 | 2015 |
| Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module | 1 | 0.40 | 2015 |
| Noise coupling modeling and analysis of through glass via(TGV) | 0 | 0.34 | 2015 |
| Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) | 11 | 0.73 | 2015 |
| Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation | 3 | 0.39 | 2015 |
| Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC | 0 | 0.34 | 2015 |
| Active Si interposer for 3D IC integrations | 1 | 0.36 | 2015 |
| Electromagnetic Compatibility Of Resonance Coupling Wireless Power Transfer In On-Line Electric Vehicle System | 1 | 0.36 | 2014 |
| Analysis and optimization of a power distribution network in 2.5D IC with glass interposer | 0 | 0.34 | 2014 |
| Fault detection and isolation of multiple defects in through silicon via (TSV) channel | 0 | 0.34 | 2014 |
| Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs | 1 | 0.63 | 2014 |
| Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System | 3 | 0.48 | 2013 |
| Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling | 0 | 0.34 | 2013 |
| Signal integrity modeling and measurement of TSV in 3D IC | 4 | 0.55 | 2013 |
| Eye-diagram simulation and analysis of a high-speed TSV-based channel | 0 | 0.34 | 2013 |
| Fault isolation of short defect in through silicon via (TSV) based 3D-IC. | 3 | 0.96 | 2013 |
| Signal Integrity Design Of Tsv And Interposer In 3d-Ic | 0 | 0.34 | 2013 |
| Non-contact wafer-level TSV connectivity test methodology using magnetic coupling | 2 | 0.39 | 2013 |
| Analysis of glass interposer PDN and proposal of PDN resonance suppression methods | 1 | 0.63 | 2013 |
| 3D-MAPS: 3D Massively parallel processor with stacked memory | 70 | 2.73 | 2012 |
| Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC | 41 | 2.22 | 2011 |
| Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs | 14 | 1.56 | 2011 |
| Frequency-Dependent Transmission Line Model Of A Stranded Coaxial Cable | 0 | 0.34 | 2010 |
| A Delay Line Circuit Design for Crosstalk Minimization Using Genetic Algorithm | 1 | 0.35 | 2008 |
| Co-Modeling, Experimental Verification, And Analysis Of Chip-Package Hierarchical Power Distribution Network | 0 | 0.34 | 2008 |
| Design of a Low-Noise UWB Transceiver SiP | 0 | 0.34 | 2008 |
| Band-Stop Filter Effect Of Power/Ground Plane On Through-Hole Signal Via In Multilayer Pcb | 0 | 0.34 | 2006 |
| A 20-GHz Phase-Locked Loop for 40-Gb/s Serializing Transmitter in 0.13-<tex>$muhboxm$</tex>CMOS | 7 | 1.30 | 2006 |
| Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array | 1 | 0.48 | 2006 |
| Modeling And Measurement Of Mode-Conversion And Frequency Dependent Loss In High-Speed Differential Interconnections On Multilayer Pcb | 0 | 0.34 | 2005 |
| Sensible agent technology improving coordination and communication in biosurveillance domains | 0 | 0.34 | 2003 |
| Sensible agents: an implemented multi-agent system and testbed | 5 | 0.93 | 2001 |
| Constructing and dynamically maintaining perspective-based agent models in a multi-agent environment | 5 | 0.57 | 1999 |
| A 32-bank 1 Gb self-strobing synchronous DRAM with 1 GByte/s bandwidth | 9 | 3.28 | 1996 |
