Author Info
Name
Affiliation
Papers
HUN SHEN NG
Amkor Technology, Inc., No. 2, Science Park Drive, Singapore 118222, Singapore
6
Collaborators
Citations 
PageRank 
13
56
21.96
Referers 
Referees 
References 
135
11
6
Search Limit
100135
Title
Citations
PageRank
Year
Advanced analysis on board trace reliability of WLCSP under drop impact20.472010
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA50.522006
Impact life prediction modeling of TFBGA packages under board level drop test309.002004
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications129.312003
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages61.842003
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn10.822003