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TONG YAN TEE
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Name
Affiliation
Papers
TONG YAN TEE
Nepes Pte. Ltd. 12 Ang Mo Kio Street 65, Singapore 569060, Singapore Tel.: +65 6412 8167; fax: +65 6412 8111
11
Collaborators
Citations
PageRank
18
84
27.45
Referers
Referees
References
187
22
12
Search Limit
100
187
Publications (11 rows)
Collaborators (18 rows)
Referers (100 rows)
Referees (22 rows)
Title
Citations
PageRank
Year
Advanced analysis on board trace reliability of WLCSP under drop impact
2
0.47
2010
Advances in Wafer Level Packaging (WLP)
0
0.34
2010
Dynamic responses and solder joint reliability under board level drop test
7
1.22
2007
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA
5
0.52
2006
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis
8
1.57
2004
Impact life prediction modeling of TFBGA packages under board level drop test
30
9.00
2004
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.
10
1.14
2004
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications
12
9.31
2003
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill
3
1.23
2003
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages
6
1.84
2003
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn
1
0.82
2003
1