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HÉLÈNE FRÉMONT
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Name
Affiliation
Papers
HÉLÈNE FRÉMONT
Laboratoire de Microelectronique, IXL, Bordeaux, France
28
Collaborators
Citations
PageRank
50
20
12.71
Referers
Referees
References
28
117
47
Search Limit
100
117
Publications (28 rows)
Collaborators (50 rows)
Referers (28 rows)
Referees (100 rows)
Title
Citations
PageRank
Year
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation.
0
0.34
2018
Sequential combined thermal cycling and vibration test and simulation of printed circuit board.
0
0.34
2018
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach.
0
0.34
2017
Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis.
0
0.34
2017
High temperature ageing of microelectronics assemblies with SAC solder joints.
0
0.34
2017
Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.
1
0.63
2017
Effects of salt spray test on lead-free solder alloy.
0
0.34
2016
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps.
1
0.41
2015
Virtual prototyping in a Design-for-Reliability approach
0
0.34
2015
A methodologic project to characterize and model COTS component reliability
0
0.34
2015
Characterization and model of temperature effect on the conducted immunity of Op-Amp
1
0.48
2015
Dynamical IMC-growth calculation
0
0.34
2015
Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques.
0
0.34
2013
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads.
1
0.41
2013
Conductive adhesive joint for extreme temperature applications.
2
0.47
2013
Electro- and thermo-migration induced failure mechanisms in Package on Package.
1
0.45
2012
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers.
1
0.45
2012
Pushing toward the limits of acceleration: Example on wire-bond assemblies.
0
0.34
2012
PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning.
1
0.63
2012
A methodological approach for predictive reliability: Practical case studies.
1
0.39
2012
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength.
2
0.53
2012
International dimension to increase Lifelong Learning possibilities in Europe.
0
0.34
2012
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.
4
0.72
2011
Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow.
1
0.37
2011
Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications
0
0.34
2010
A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages
0
0.34
2009
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations
2
1.65
2005
How to study delamination in plastic encapsulated devices.
1
0.39
2004
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