Author Info
Name
Affiliation
Papers
LI-HSIN CHANG
Department of Electrical and Computer Engineering, University of Arizona, Tuscon, AZ 85721, United States
1
Collaborators
Citations 
PageRank 
2
6
1.13
Referers 
Referees 
References 
32
0
0
Title
Citations
PageRank
Year
The effect of die attach voiding on the thermal resistance of chip level packages61.132006