H. Lu - Citegraph

Author Info

Name	Affiliation	Papers
H. LU	Univ Greenwich, Computat Mech & Reliabil Grp, London SE10 9LS, England	12
Collaborators	Citations	PageRank
27	27	7.14
Referers	Referees	References
93	95	36

Publications (12 rows)

Collaborators (27 rows)

Referers (93 rows)

Referees (95 rows)

Title	Citations	PageRank	Year
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables.	0	0.34	2018
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.	0	0.34	2018
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.	0	0.34	2017
Sintered silver finite element modelling and reliability based design optimisation in power electronic module	2	0.52	2015
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module	0	0.34	2015
Integration of analytical techniques in stochastic optimization of microsystem reliability	0	0.34	2011
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects	0	0.34	2010
Design for reliability of power electronics modules	18	2.56	2009
Failure mechanisms of ACF joints under isothermal ageing	3	0.46	2008
Study of anisotropic conductive adhesive joint behavior under 3-point bending	1	0.39	2005
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications	1	0.43	2003
No-flow underfill flip chip assembly––an experimental and modeling analysis	2	0.75	2002

1