Author Info
Name
Affiliation
Papers
QIANG XU
Chinese Univ Hong Kong, Dept Comp Sci & Engn, CUhk REliable Comp Lab CURE, Shatin, Hong Kong, Peoples R China
2
Collaborators
Citations 
PageRank 
5
16
1.03
Referers 
Referees 
References 
47
93
27
Title
Citations
PageRank
Year
Yield and reliability enhancement for 3D ICs: Dissertation summary: IEEE TTTC E.J. McCluskey doctoral thesis award competition finalist10.342015
Modeling Tsv Open Defects In 3d-Stacked Dram150.682010