Zhao-Wei Zhong - Citegraph

Author Info

Name	Affiliation	Papers
ZHAO-WEI ZHONG	School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore	19
Collaborators	Citations	PageRank
23	212	36.01
Referers	Referees	References
563	99	55

Search Limit

100563

Publications (19 rows)

Collaborators (23 rows)

Referers (100 rows)

Referees (99 rows)

Title	Citations	PageRank	Year
Re-Planning of Flight Routes Avoiding Convective Weather and the "Three Areas".	2	0.43	2018
Dominant Feature Identification for Industrial Fault Detection and Isolation Applications	1	0.34	2011
Tool Wear Monitoring Using Acoustic Emissions by Dominant-Feature Identification	22	1.45	2011
Tool wear forecast using Dominant Feature Identification of acoustic emissions	1	0.63	2010
Design concept evaluation in product development using rough sets and grey relation analysis	32	1.22	2009
A dominance-based rough set approach to Kansei Engineering in product development	29	1.12	2009
A rough set based QFD approach to the management of imprecise design information in product development	15	0.64	2009
Intelligent Diagnosis and Prognosis of Tool Wear Using Dominant Feature Identification	23	2.31	2009
Dynamic responses and solder joint reliability under board level drop test	7	1.22	2007
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA	5	0.52	2006
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints	5	0.90	2006
Huge Proteins in The Human Proteome and Their Participation in Hereditary Diseases.	0	0.34	2006
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis	8	1.57	2004
Impact life prediction modeling of TFBGA packages under board level drop test	30	9.00	2004
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.	10	1.14	2004
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications	12	9.31	2003
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill	3	1.23	2003
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages	6	1.84	2003
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn	1	0.82	2003

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