Author Info
Name
Affiliation
Papers
K. SRIHARI
Department of Systems Science and Industrial Engineering, Watson School of Engineering and Applied Sciences, State University of New York at Binghamton, Binghamton, NY 13902, USA
1
Collaborators
Citations 
PageRank 
3
4
1.28
Referers 
Referees 
References 
20
0
0
Title
Citations
PageRank
Year
Effect of voids on the reliability of BGA/CSP solder joints41.282003