Author Info
Name
Affiliation
Papers
S. TESTA
STMicroelectronics, Via C. Olivetti 2, Agrate Brianza – Italy
2
Collaborators
Citations 
PageRank 
6
1
0.71
Referers 
Referees 
References 
9
4
1
Title
Citations
PageRank
Year
Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism00.342015
Read disturb in flash memories: reliability case10.372006