Author Info
Name
Affiliation
Papers
K. DEMIR
3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive N.W., Atlanta, GA 30332, United States
1
Collaborators
Citations 
PageRank 
6
1
0.63
Referers 
Referees 
References 
7
0
0
Title
Citations
PageRank
Year
A study of through package vias in a glass interposer for multifunctional and miniaturized systems.10.632014