Y.C Chan - Citegraph

Author Info

Name	Affiliation	Papers
Y.C CHAN	Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong	16
Collaborators	Citations	PageRank
20	50	16.44
Referers	Referees	References
150	14	10

Search Limit

100150

Publications (16 rows)

Collaborators (20 rows)

Referers (100 rows)

Referees (14 rows)

Title	Citations	PageRank	Year
Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates	3	0.59	2011
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads	0	0.34	2011
Effect of microwave preheating on the bonding performance of flip chip on flex joint	0	0.34	2004
Bias-HAST on tape ball grid array (TBGA) test pattern	0	0.34	2004
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film	7	2.34	2004
Behaviour of anisotropic conductive joints under mechanical loading	6	1.65	2003
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications	1	0.43	2003
Effect of autoclave test on anisotropic conductive joints	4	1.04	2003
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization	4	0.56	2003
Application of adhesive bonding techniques in hard disk drive head assembly	1	0.48	2002
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies	3	1.52	2002
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects	6	1.54	2002
Reliability study of the electroless Ni–P layer against solder alloy	5	1.42	2002
Study of micro-BGA solder joint reliability	6	1.37	2001
Reliability of microBGA assembly using no-flow underfill	3	1.51	2001
Study of the self-alignment of no-flow underfill for micro-BGA assembly	1	0.98	2001

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