Author Info
Name
Affiliation
Papers
HIROFUMI ABE
Electronics Materials Research Laboratories, Research & Development Management, Headquarters FUJIFILM Corporation, Yoshida, Japan
1
Collaborators
Citations 
PageRank 
4
0
0.34
Referers 
Referees 
References 
0
0
0
Title
Citations
PageRank
Year
Copper-filled anodized aluminum oxide a potential material for chip to chip bonding00.342015