Author Info
Name
Affiliation
Papers
KING-NING TU
Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA
5
Collaborators
Citations 
PageRank 
17
54
7.11
Referers 
Referees 
References 
150
10
3
Search Limit
100150
Title
Citations
PageRank
Year
Growth competition between layer-type and porous-type Cu3Sn in microbumps.00.342017
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy.50.632013
Reliability of micro-interconnects in 3D IC packages.20.712013
Reliability challenges in 3D IC packaging technology444.852011
A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects30.582006