| Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling | 0 | 0.34 | 2022 |
| EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks | 0 | 0.34 | 2021 |
| Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging | 0 | 0.34 | 2021 |
| Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. | 0 | 0.34 | 2020 |
| EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects | 0 | 0.34 | 2020 |
| HAT-DRL: Hotspot-Aware Task Mapping for Lifetime Improvement of Multicore System using Deep Reinforcement Learning**This work is supported in part by NSF grants under No. CCF-1816361, in part by NSF grant under No. CCF-2007135 and No. OISE-1854276 | 0 | 0.34 | 2020 |
| Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning**This work is supported in part by NSF grants under No. CCF-1816361, in part by NSF grant under No. CCF-2007135 and No. OISE-1854276. | 0 | 0.34 | 2020 |
| Machine Learning Based Online Full-Chip Heatmap Estimation | 0 | 0.34 | 2020 |
| EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks | 1 | 0.36 | 2019 |
| Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging | 1 | 0.35 | 2019 |
| Saturation-Volume Estimation for Multisegment Copper Interconnect Wires | 1 | 0.36 | 2019 |
| Accelerating electromigration aging for fast failure detection for nanometer ICs. | 0 | 0.34 | 2018 |
| Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. | 1 | 0.39 | 2018 |
