Author Info
Name
Affiliation
Papers
DANIEL W. M. VELDMAN
Eindhoven University of Technology, Eindhoven, MB, The Netherlands
1
Collaborators
Citations 
PageRank 
5
0
0.34
Referers 
Referees 
References 
0
15
7
Title
Citations
PageRank
Year
Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation00.342021