Title
Hierarchical distributed simulation for 300mm wafer fab
Abstract
Distributed simulation promises benefits in large-scale simulations, such as in high fidelity simulation of 300 mm wafer fabs, although these benefits have been hard to achieve in practice. This paper examines the fundamentals of distributed simulation, and proposes a hierarchical approach to distributed wafer fab simulation, which has the potential to achieve significant reduction in model execution time.
Year
DOI
Venue
2007
10.1109/WSC.2007.4419802
Winter Simulation Conference
Keywords
Field
DocType
production engineering computing,high fidelity simulation,hierarchical approach,wafer fabs,large-scale simulation,large-scale simulations,semiconductor device manufacture,hierarchical distributed simulation,model execution time,digital simulation,significant reduction,wafer-scale integration,wafer fab simulation,distributed processing,wafer fab
High fidelity,Wafer,Computer science,Simulation,Wafer fabrication,Execution time,Wafer-scale integration
Conference
ISBN
Citations 
PageRank 
978-1-4244-1306-5
0
0.34
References 
Authors
3
2
Name
Order
Citations
PageRank
Sheng Xu150771.47
Leon F. McGinnis249450.09