Name
Title | ||
|---|---|---|
Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies |
Abstract | ||
|---|---|---|
In this paper board-level reliability of low-temperature co-fired ceramic (LTCC) modules with thermo-mechanically enhanced ball-grid-array (BGA) solder joint structure mounted on a printed wiring board (PWB) was experimentally investigated by thermal cycling tests in the 0–100°C and −40 to 125°C temperature ranges. The enhanced joint structure comprised solder mask defined (SMD) AgPt pad metallization, eutectic solder and plastic-core solder balls (PCSB). Similar daisy-chained LTCC modules with non-collapsible 90Pb10Sn solder spheres were used for a reference test set. The reliability of the joint structures was analyzed by resistance measurements, X-ray microscopy, scanning acoustic microscopy (SAM) and SEM/EDS investigation. In addition, a full-wave electromagnetic analysis was performed to study effects of the plastic-core material on the RF performance of the LTCC/BGA package transition up to millimeter-wave frequencies. Thermal cycling results of the modules with PCSBs demonstrated excellent fatigue performance over that of the reference. In the harsher cycling test, Weibull’s shape factor β values of 7.9 and 4.8, and characteristic lifetime θ values of 1378 and 783 were attained for the modules with PCSBs and 90Pb10Sn solder spheres, respectively. The primary failure mode in all test assemblies was fatigue cracking in eutectic solder on the ceramic side. |
Year | DOI | Venue |
|---|---|---|
2006 | 10.1016/j.microrel.2005.11.003 | Microelectronics Reliability |
Keywords | Field | DocType |
failure mode,printed wiring board,millimeter wave,ball grid array,thermal cycling | Ceramic,Ball grid array,Solder mask,Electronic packaging,Printed circuit board,Surface-mount technology,Electronic engineering,Soldering,Temperature cycling,Engineering | Journal |
Volume | Issue | ISSN |
46 | 8 | 0026-2714 |
Citations | PageRank | References |
2 | 0.67 | 1 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| T. Kangasvieri | 1 | 5 | 1.16 |
| O. Nousiainen | 2 | 7 | 2.10 |
| J. Putaala | 3 | 7 | 3.16 |
| R. Rautioaho | 4 | 7 | 2.10 |
| J. Vähäkangas | 5 | 5 | 1.16 |