Abstract | ||
---|---|---|
This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines. |
Year | DOI | Venue |
---|---|---|
2010 | 10.1016/j.compeleceng.2009.07.001 | Computers & Electrical Engineering |
Keywords | Field | DocType |
thermal model,thermal analysis,thermal behavior,total temperature,compact modeling approach,temperature,source code modification,thermal effect,temperature gradient,complete modeling approach,embedded processor,deep knowledge,black box technique,code transformation,chip,source code | Black box (phreaking),Thermal,Source code,Computer science,Total air temperature,Real-time computing,Chip,Compiler,Thermal analysis,Deep knowledge | Journal |
Volume | Issue | ISSN |
36 | 1 | Computers and Electrical Engineering |
Citations | PageRank | References |
0 | 0.34 | 12 |
Authors | ||
3 |
Name | Order | Citations | PageRank |
---|---|---|---|
José L. Ayala | 1 | 180 | 20.44 |
Cándido Méndez | 2 | 0 | 0.68 |
Marisa López-Vallejo | 3 | 145 | 20.48 |