Title
Thermal analysis and modeling of embedded processors
Abstract
This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines.
Year
DOI
Venue
2010
10.1016/j.compeleceng.2009.07.001
Computers & Electrical Engineering
Keywords
Field
DocType
thermal model,thermal analysis,thermal behavior,total temperature,compact modeling approach,temperature,source code modification,thermal effect,temperature gradient,complete modeling approach,embedded processor,deep knowledge,black box technique,code transformation,chip,source code
Black box (phreaking),Thermal,Source code,Computer science,Total air temperature,Real-time computing,Chip,Compiler,Thermal analysis,Deep knowledge
Journal
Volume
Issue
ISSN
36
1
Computers and Electrical Engineering
Citations 
PageRank 
References 
0
0.34
12
Authors
3
Name
Order
Citations
PageRank
José L. Ayala118020.44
Cándido Méndez200.68
Marisa López-Vallejo314520.48