Name
Abstract | ||
|---|---|---|
Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids overheating. |
Year | DOI | Venue |
|---|---|---|
2009 | 10.1145/1687399.1687520 | ICCAD |
Keywords | Field | DocType |
avoids over-heating,fan speed,thermal resistance,microprocessors,power consumption,microprocessor chips,energy-optimal dynamic thermal management,cooling system,cooling,thermal management system,heat sink,thermal management (packaging),control variable,thermal emergency,usual forced-convection heat-sink,heat sinks,dynamic thermal management,rational objective,energy-optimal steady-state temperature,green computing,design of experiments,thermal management,energy optimization,steady state,forced convection,through silicon via | Green computing,Computer science,Voltage,Microprocessor,Electronic engineering,Water cooling,Control variable,Heat sink,Design of experiments,Thermal resistance | Conference |
ISSN | ISBN | Citations |
1092-3152 E-ISBN : 978-1-60558-800-1 | 978-1-60558-800-1 | 20 |
PageRank | References | Authors |
1.59 | 14 | 6 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Donghwa Shin | 1 | 396 | 32.34 |
| Jihun Kim | 2 | 160 | 15.11 |
| Naehyuck Chang | 3 | 1985 | 185.85 |
| Jinhang Choi | 4 | 22 | 1.98 |
| Sung Woo Chung | 5 | 363 | 34.87 |
| Eui-Young Chung | 6 | 635 | 71.51 |