Title
Investigating the Design, Performance, and Reliability of Multi-Walled Carbon Nanotube Interconnect
Abstract
In this paper, we develop a quantitative design technique for multi-walled carbon nanotube (MWCNT) based interconnect, which we utilize to examine the performance and reliability of future nanotube-based interconnect solutions. Leveraging an analytical RLC model for MWCNTs, we create the first closed-form formulation for the optimal nanotube diameter and nanotube bundle height. The results indicate that the proposed design method decreases delay by 21% and 29% on average compared to non-optimized MWCNTs and single-walled carbon nanotube (SWCNT) bundles. We also find that large diameter MWCNT bundles are significantly more susceptible to process variations than SWCNT bundles, which will have important reliability implications in future nano-scale ICs.
Year
DOI
Venue
2008
10.1109/ISQED.2008.123
ISQED
Keywords
Field
DocType
future nano-scale ics,nanotube bundle height,single-walled carbon nanotube,optimal nanotube diameter,multi-walled carbon nanotube,multi-walled carbon nanotube interconnect,swcnt bundle,proposed design method,non-optimized mwcnts,large diameter mwcnt bundle,important reliability implication,interconnect,carbon nanotubes,process variation,design method,copper,conductivity,nanoelectronics,predictive models,design methodology,contact resistance,carbon nanotube,integrated circuit design
Contact resistance,Nanoelectronics,Nanotube,Computer science,Electronic engineering,Integrated circuit design,Carbon nanotube,Interconnection,RLC circuit,Bundle
Conference
Citations 
PageRank 
References 
1
0.45
4
Authors
2
Name
Order
Citations
PageRank
Arthur Nieuwoudt120720.59
Yehia Massoud2772113.05