Title
A 126 Mm(2) 4-Gb Multilevel Ag-And Flash Memory With Inversion-Layer-Bit-Line Technology
Abstract
A 4-Gb AG-AND flash memory was fabricated by using a 90-nm CMOS technology. To reduce cell size, an inversion-layer-bit-line technology was developed, enabling the elimination of both shallow trench isolations and diffusion layers from the memory cells. The inversion-layer-bit-line technology combined with a multilevel cell technique achieved a bit area 2F(2) of 0.0162 mu m(2), resulting in a chip size of 126 mm(2). Both an address and temperature compensation techniques control the resistance of the inversion-layer local bit line. Source-side hot-electron injection programming with self-boosted charge, accumulated in inversion-layer bit lines under assist gates, reduces the dispersal of programming characteristics and also reduces the time overhead of pre-charging the bit lines. This self-boosted charge-injection scheme achieves a programming throughput of 10 MB/s.
Year
DOI
Venue
2007
10.1093/ietele/e90-c.11.2146
IEICE TRANSACTIONS ON ELECTRONICS
Keywords
DocType
Volume
flash memory, multilevel, inversion-layer-bit-line, AG-AND
Journal
E90C
Issue
ISSN
Citations 
11
1745-1353
0
PageRank 
References 
Authors
0.34
0
15