Name
Abstract | ||
|---|---|---|
The impending doom of CMOS scaling has semiconductor mavericks scrambling for alternative solutions to continue increasing the device density per chip. One serious candidate is 3D integration in which the planar manufacturing technology extends skyward into the third dimension, much like skyscrapers. Similarities between chip architecture and building architecture are plentiful, and the author draws some parallels between the two. |
Year | DOI | Venue |
|---|---|---|
2009 | 10.1109/MDT.2009.127 | IEEE Design & Test of Computers |
Keywords | Field | DocType |
device density,chip architecture,planar manufacturing technology,alternative solution,building architecture,impending doom,serious candidate,cmos scaling,mass production,cmos technology,architecture,3d ic,chip,stacking | Architecture,Parallels,Scrambling,Computer science,CMOS,Electronic engineering,Chip,Cmos scaling,Three-dimensional integrated circuit,Electrical engineering,Stacking | Journal |
Volume | Issue | ISSN |
26 | 5 | 0740-7475 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
1 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| David S. Kung | 1 | 166 | 20.93 |