Title
Prevention of Hot Spot Development on Coarse-Grained Dynamically Reconfigurable Architectures
Abstract
With the increasing power density of deep submicron technology, temperature becomes one of the dominating factors for the reliability of integrated circuits. Coarse-grained reconfigurable devices typically exhibit spatially nonuniform activity, which results in areas of localized heating, so called hot spots. In this work we investigate the effects of continuous activity migration in order to prevent hot spots. By applying activity migration we are able to reduce temporal and spatial variations of temperature by up to 87%.
Year
DOI
Venue
2009
10.1109/ReConFig.2009.18
ReConFig
Keywords
Field
DocType
integrated circuit reliability,reconfigurable architectures,coarse-grained dynamically reconfigurable architectures,coarse-grained reconfigurable devices,deep submicron technology,hot spot development prevention,integrated circuit reliability,power density,coarse-grained,hot spot,reconfigurable computing,reliability,temperature optimization
Hot spot (veterinary medicine),Computer science,Hotspot (geology),Parallel computing,Power density,Integrated circuit,Reconfigurable computing
Conference
Citations 
PageRank 
References 
2
0.37
7
Authors
5
Name
Order
Citations
PageRank
Sven Eisenhardt1364.54
Thomas Schweizer27410.73
Andreas Bernauer3384.68
Tommy Kuhn4516.75
Wolfgang Rosenstiel51462212.32