Name
Abstract | ||
|---|---|---|
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-Error-Rate (BER), depends on assembly and synchronization accuracy we performed a statistical analysis of assembly procedures and communication circuits. In this paper we present a yield prediction methodology for 3D capacitive links: starting from the analysis of communication circuits and BER measurements, we analyze stacking variability in order to predict reliability and performance. The proposed parametric yield analysis is demonstrated on a test-case, with constrained inter-electrode coupling and operating frequency. |
Year | DOI | Venue |
|---|---|---|
2006 | 10.1145/1233501.1233667 | ICCAD |
Keywords | Field | DocType |
capacitance,integrated circuit interconnections,statistical analysis,3D capacitive interconnection,3D capacitive links,AC links,assembly procedures,communication circuits,high-speed signaling,low-power signaling,parametric yield analysis,stacking variability,statistical analysis,yield prediction | Synchronization,Capacitance,Coupling,Computer science,Communication circuits,Capacitive sensing,Real-time computing,Electronic engineering,Parametric statistics,Electrical engineering,Statistical analysis,Stacking | Conference |
ISBN | Citations | PageRank |
1-59593-389-1 | 2 | 0.62 |
References | Authors | |
8 | 8 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| A. Fazzi | 1 | 94 | 8.38 |
| L. Magagni | 2 | 2 | 0.62 |
| M. De Dominicis | 3 | 2 | 0.96 |
| P. Zoffoli | 4 | 2 | 0.62 |
| R. Canegallo | 5 | 4 | 2.14 |
| P. L. Rolandi | 6 | 11 | 3.59 |
| Alberto L. Sangiovanni-Vincentelli | 7 | 11385 | 1881.40 |
| R Guerrieri | 8 | 124 | 30.04 |