Name
Title | ||
|---|---|---|
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers. |
Year | DOI | Venue |
|---|---|---|
2010 | 10.1109/3DIC.2010.5751438 | 3DIC |
Keywords | Field | DocType |
conductivity,high aspect ratio,nib,electroplating,annealing,films,copper,adhesives,cu | Substrate (chemistry),Composite material,Barrier layer,Annealing (metallurgy),Metallurgy,Adsorption,Silane,Materials science,Nanoparticle,Fabrication,Electroplating | Conference |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
7 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Fumihiro Inoue | 1 | 1 | 3.74 |
| Takumi Yokoyama | 2 | 0 | 0.34 |
| Hiroshi Miyake | 3 | 0 | 0.34 |
| Shukichi Tanaka | 4 | 2 | 1.76 |
| Toshifumi Terui | 5 | 0 | 0.34 |
| Tomohiro Shimizu | 6 | 0 | 0.68 |
| Shoso Shingubara | 7 | 0 | 0.68 |