Name
Title | ||
|---|---|---|
Power profiling-guided floorplanner for thermal optimization in 3D multiprocessor architectures |
Abstract | ||
|---|---|---|
3D integration has become one of the most promising techniques for the integration future multi-core processors, since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Thermal-aware floorplanners can play an important role to improve the thermal profile, but they have failed in considering the dynamic power profiles of the applications. This paper proposes a novel thermal-aware floorplanner guided by the power profiling of a set of benchmarks that are representative of the application scope. The results show how our approach outperforms the thermal metrics as compared with the worst-case scenario usually considered in "traditional" thermal-aware floorplanners. |
Year | DOI | Venue |
|---|---|---|
2011 | 10.1007/978-3-642-24154-3_2 | PATMOS |
Keywords | Field | DocType |
dynamic power profile,application scope,power profiling-guided floorplanner,multiprocessor architecture,thermal-aware floorplanners,power consumption,serious thermal problem,thermal profile,integration future multi-core processor,thermal optimization,thermal metrics,novel thermal-aware floorplanner,thermal hotspots | Thermal optimization,Shared memory,Profiling (computer programming),Computer science,Real-time computing,Multiprocessing,Dynamic demand,Power consumption | Conference |
Volume | ISSN | Citations |
6951 | 0302-9743 | 1 |
PageRank | References | Authors |
0.35 | 18 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Ignacio Arnaldo | 1 | 81 | 7.69 |
| José L. Risco-Martín | 2 | 244 | 31.13 |
| José L. Ayala | 3 | 180 | 20.44 |
| J. Ignacio Hidalgo | 4 | 135 | 14.86 |