Name
Abstract | ||
|---|---|---|
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide dielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described. |
Year | DOI | Venue |
|---|---|---|
1998 | 10.1147/rd.425.0587 | IBM Journal of Research and Development |
Field | DocType | Volume |
Polyimide dielectric,Metallizing,Computer science,Electronic engineering,Interconnection,Electroplating | Journal | 42 |
Issue | ISSN | Citations |
5 | 0018-8646 | 1 |
PageRank | References | Authors |
1.24 | 3 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| K. K. H. Wong | 1 | 1 | 1.24 |
| S. Kaja | 2 | 5 | 3.12 |
| P. W. DeHaven | 3 | 1 | 1.24 |