Name
Abstract | ||
|---|---|---|
As the process technology advances, via failure is still one of the dominant defects for semiconductor manufacturing in nanometer territory. Nowadays, redundant via insertion is the typical approach to improve yield and reliability. Increasing double-via insertion rate in concurrent routing or post-routing stage is the major objective in recent academic research. However, redundant via insertion in double-via pattern is required considerably additional routing resources that limits routers to enhance the redundant via insertion rate, especially in congestion designs. This study proposes an efficient post-routing redundant via insertion approach that considers different via configurations in two-phase flow to increase total via and via1 insertion rate. Our approach is the first to combine double-via and rectangle-via patterns that overcomes the limitation of double-via insertion. Experiment results show that the proposed methodology with the multi-via mechanisms can improve the total via insertion rate from 86.9% to 92.7%, and the via1 insertion rate from 73.9% to 85.2%. |
Year | DOI | Venue |
|---|---|---|
2011 | 10.1109/ISVLSI.2011.50 | ISVLSI |
Keywords | Field | DocType |
rectangle-via pattern,double-via insertion rate,network routing,additional routing resource,enhanced redundant,post-routing redundant via insertion approach,insertion approach,concurrent routing,double-via insertion,double-via pattern,nanometer territory,semiconductor device reliability,via1 insertion rate,semiconductor device manufacture,multivia mechanism,efficient post-routing redundant,multi-via mechanisms,two-phase flow,semiconductor manufacturing,insertion rate,typical approach,integrated circuits,routing,two phase flow,manufacturing,redundancy,bipartite graph,metals,layout | Network routing,Semiconductor device fabrication,Bipartite graph,Electronic engineering,Redundancy (engineering),Engineering,Integrated circuit,Distributed computing | Conference |
ISSN | ISBN | Citations |
2159-3469 E-ISBN : 978-0-7695-4447-2 | 978-0-7695-4447-2 | 5 |
PageRank | References | Authors |
0.47 | 5 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Ting-Feng Chang | 1 | 8 | 1.55 |
| Tsang-Chi Kan | 2 | 9 | 2.92 |
| Shih-Hsien Yang | 3 | 103 | 9.72 |
| Shanq-Jang Ruan | 4 | 375 | 55.44 |