Title
Trends Of On-Chip Interconnects In Deep Sub-Micron Vlsi
Abstract
This paper discusses propagation delay error, transient response, and power consumption distribution due to inductive effects in optimal buffered on-chip interconnects. Inductive effect is said to be important to consider in deep submicron (DSM) VLSI design. However, study shows that the effect decreases and can be neglected in next technology nodes for such conditions.
Year
DOI
Venue
2006
10.1093/ietele/e89-c.3.392
IEICE TRANSACTIONS ON ELECTRONICS
Keywords
Field
DocType
on-chip interconnects, deep sub-micron, inductive effect, signal integrity
Transient response,Propagation delay,Signal integrity,Electronic engineering,Integrated circuit design,Engineering,Miniaturization,Interconnection,Electrical engineering,Very-large-scale integration,Integrated circuit
Journal
Volume
Issue
ISSN
E89C
3
1745-1353
Citations 
PageRank 
References 
2
0.41
1
Authors
4
Name
Order
Citations
PageRank
Danardono Dwi Antono141.14
Kenichi Inagaki2263.50
Hiroshi Kawaguchi339591.51
Takayasu Sakurai4384.53