Paper Info
Title
Reliability of Low-Cost PCB Interconnections for Telecommunication Applications.
Abstract
Today the low cost PCB interconnections are widely used for domestic telecommunication applications. These technologies are limited by the possible variation of the performances of substrates and metallization during operating life. The knowledge of the behaviour of these parameters under stress conditions allows to optimise the design safety margins and to predict a probable lifetime. In this paper we show that the proposed structures (rings and stub resonators) could be used to discriminate the degradation sources. (C) 2004 Elsevier Ltd. All rights reserved.
Year
DOI
Venue
2004
10.1016/j.microrel.2004.07.013
MICROELECTRONICS RELIABILITY
Field
DocType
Volume
Stub (electronics),Telecommunications,Durability,Stress conditions,Resonator,Printed circuit board,Telecommunications equipment,Electronic engineering,Engineering,Interconnection,Integrated circuit,Reliability engineering
Journal
44
Issue
ISSN
Citations 
9-11
0026-2714
0
PageRank 
References 
Authors
0.34
0
6
Name
Order
Citations
PageRank
Geneviève Duchamp1125.38
Frédéric Verdier210.74
Y. Deshayes395.48
François Marc400.68
Y. Ousten5165.71
Yves Danto6104.75