Name
Title | ||
|---|---|---|
Optical Connection Between Optical Via Hole In Bga Package And Optical Waveguide On Board |
Abstract | ||
|---|---|---|
We propose a gap-less optical interconnection between BGA package and board for practical on-board, chip-to-chip optical interconnection. The optical interconnect consists of polymer optical waveguides, an integral mirror on the PWB (printed wiring board), an optical via hole through package, and a connection structure and method requiring no alignment process. Optical waveguide, mirror, waveguide extensions and alignment studs were fabricated on the PWB as horizontal optical interconnect. Coaxial structured optical vias with core and cladding were formed through the package and with precise holes for alignment. Two packages were attached onto the PWB using standard BGA technology utilizing passive optical alignment. The optical characteristics and 10 Gbit/s open-eye diagram were measured. A completely gap-less three dimensional optical interconnect between package-PWB-package was demonstrated. |
Year | DOI | Venue |
|---|---|---|
2009 | 10.1587/transele.E92.C.239 | IEICE TRANSACTIONS ON ELECTRONICS |
Keywords | Field | DocType |
optical interconnection, optical waveguide, optical via hole, BGA assembly | Ball grid array,Coaxial,Waveguide (optics),Waveguide,Printed circuit board,Optics,Electronic packaging,Electronic engineering,Engineering,Cladding (metalworking),Optical interconnect | Journal |
Volume | Issue | ISSN |
E92C | 2 | 1745-1353 |
Citations | PageRank | References |
1 | 0.63 | 2 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Keiko Oda | 1 | 1 | 0.63 |
| Takahiro Matsubara | 2 | 2 | 1.01 |
| Kei-ichiro Watanabe | 3 | 1 | 0.63 |
| Kaori Tanaka | 4 | 2 | 1.67 |
| Maraki Maetani | 5 | 1 | 0.63 |