Paper Info
Title
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA
Abstract
Stacked die BGA has recently gained popularity in telecommunication applications. However, its board level solder joint reliability during the thermal cycling test is not as well-studied as common single die BGA. In this paper, solder joint fatigue of lead-free stacked die BGA with mixed flip-chip (FC) and wirebond (WB) interconnect is analyzed in detail. 3D fatigue model is established for stacked die BGA with considerations of detailed pad design, realistic shape of solder ball, and non-linear material properties. The fatigue model applied is based on a modified Darveaux’s approach with non-linear viscoplastic analysis of solder joints. Based on the FC–WB stack die configuration, the critical solder ball is observed located between the top and bottom dice corner, and failure interface is along the top solder/pad interface. The modeling predicted fatigue life is first correlated to the thermal cycling test results using modified correlation constants, curve-fitted from in-house lead-free TFBGA46 (thin-profile fine-pitch BGA) thermal cycling test data. Subsequently, design analyzes are performed to study the effects of 20 key design variations in package dimensions, material properties, and thermal cycling test conditions. In general, thinner PCB and mold compound, thicker substrate, larger top or bottom dice sizes, thicker top die, higher solder ball standoff, larger solder mask opening, smaller PCB pad size, smaller thermal cycling temperature range, longer ramp time, and shorter dwell time contribute to longer fatigue life. SnAgCu is a common lead-free solder, and it has much better board level reliability performance than eutectic solder based on modeling results, especially low stress packages.
Year
DOI
Venue
2006
10.1016/j.microrel.2006.01.010
Microelectronics Reliability
Keywords
Field
DocType
curve fitting,material properties,flip chip,thermal cycling,dwell time
Ball grid array,Flip chip,Composite material,Wire bonding,Printed circuit board,Solder mask,Electronic packaging,Electronic engineering,Temperature cycling,Soldering,Engineering,Structural engineering
Journal
Volume
Issue
ISSN
46
12
0026-2714
Citations 
PageRank 
References 
5
0.52
3
Authors
3
Name
Order
Citations
PageRank
Tong Yan Tee18427.45
Hun Shen Ng25621.96
Zhao-Wei Zhong321236.01