Paper Info
Title
A performance guarantee heuristic for electronic components placement problems including thermal effects
Abstract
In this work, Benders decomposition algorithm is used to deal with a computer motherboard design problem. Amongst all the possible formulations for the component placement problem, the chosen one creates an instance of the extensively studied Quadratic Assignment Problem (QAP). This problem arises as a great challenge for engineers and computer scientists. The QAP inherent combinatorial structure makes the most efficient optimization algorithms to exhibit low performance for real size instances. It is also considered here the important addition of linear costs. This approach is directly responsible for the performance gain presented by our decomposition method. Coupled with the placement problem, it is under investigation the maximum temperature rising on the board surface. In order to solve the Energy Conduction Equation the Finite Volume Method is implemented, becoming possible to derive a secondary quality solution criterion. A set of test instances is then solved and the corresponding results are reported.
Year
DOI
Venue
2005
10.1016/j.cor.2004.04.014
Computers & OR
Keywords
DocType
Volume
Placement problems,possible formulation,decomposition method,electronic components placement problem,Electronics cooling,thermal effect,computer motherboard design problem,computer scientist,component placement problem,Quadratic assignment problems,Benders decomposition algorithm,QAP inherent combinatorial structure,Combinatorial optimization,performance guarantee heuristic,placement problem,benders decomposition algorithm,performance gain,low performance
Journal
32
Issue
ISSN
Citations 
11
Computers and Operations Research
7
PageRank 
References 
Authors
0.74
8
4
Name
Order
Citations
PageRank
G. Miranda170.74
H. P. L. Luna2171.92
Geraldo Robson Mateus341342.30
R. P. M. Ferreira4294.01