Paper Info
Title
Experimental study on variations of WIPLOAD control in semiconductor wafer fabricaiton environment
Abstract
WIPLOAD Control has been proposed and evaluated as an effective job release control methodology. This paper presents a further simulation experimental study on two variations of WIPLOAD Control in semiconductor wafer fab environment. The first variation mechanism is to control separate WIPLOAD for each part type at a specified level under the situation when the type of job going to be released next can be controlled. The second variation is a mechanism with additional release control points along the production line. The performance of the WIPLOAD variations are compared with that of the original WIPLOAD Control and other existing release methods including CONWIP and Constant release in semiconductor manufacturing environment. The experimental results indicate that by breaking down the control of overall fab WIPLOAD into controlling WIPLOAD level for each part type, cycle time performance can be improved especially with respect to the standard deviation of cycle time.
Year
DOI
Venue
2008
10.1109/WSC.2008.4736299
Winter Simulation Conference
Keywords
Field
DocType
wipload level,separate wipload,semiconductor wafer fabricaiton environment,wipload control,effective job release control,constant release,part type,overall fab wipload,experimental study,additional release control point,wipload variation,original wipload control,cycle time,work in progress,standard deviation,production line,mean squared error,simulation
Wafer,Production control,Industrial engineering,Work in process,Computer science,Control theory,Simulation,Semiconductor device fabrication,Mean squared error,Production line,CONWIP,Standard deviation
Conference
ISBN
Citations 
PageRank 
978-1-4244-2708-6
0
0.34
References 
Authors
2
3
Name
Order
Citations
PageRank
Appa Iyer Sivakumar118118.80
Chao Qi2272.58
Andy Darwin Kasan Hidayat300.34