Title
Reliability of micro-interconnects in 3D IC packages.
Year
DOI
Venue
2013
10.1016/j.microrel.2012.11.005
Microelectronics Reliability
Field
DocType
Volume
Three-dimensional integrated circuit,Engineering,Reliability engineering
Journal
53
Issue
ISSN
Citations 
1
0026-2714
2
PageRank 
References 
Authors
0.71
0
4
Name
Order
Citations
PageRank
C. Robert Kao121.05
Albert T. Wu221.05
King-Ning Tu3547.11
Yi-Shao Lai417246.81