Name
Title | ||
|---|---|---|
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. |
Abstract | ||
|---|---|---|
•AC stress tests on SnAgCu bumps on Ni/Au contact pads.•Electromigration driven Ni3Sn4 formation process in Cu containing lead free solders.•Material parameters for the quantification of the Ni3Sn4 and (CuNi)6Sn5 formation.•Long- and short-term temperature storage investigations of the (CuNi)6Sn5 formation.•Current crowding effects on the (CuNi)6Sn5 formation during electromigration test. |
Year | DOI | Venue |
|---|---|---|
2013 | 10.1016/j.microrel.2013.07.038 | Microelectronics Reliability |
Field | DocType | Volume |
Flip chip,Intermetallic,Electronic packaging,Soldering,Metallurgy,Engineering,Void (astronomy),Electromigration,Thermal diffusivity,Fabrication | Journal | 53 |
Issue | ISSN | Citations |
9 | 0026-2714 | 1 |
PageRank | References | Authors |
0.41 | 3 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Lutz Meinshausen | 1 | 8 | 3.47 |
| Hélène Frémont | 2 | 20 | 12.71 |
| Kirsten Weide-Zaage | 3 | 31 | 14.97 |
| B. Plano | 4 | 12 | 3.24 |