Title
Improving reliability of beveled power semiconductor devices passivated by SIPOS
Abstract
Semi-insulating polycrystalline silicon films were prepared by direct current glow discharge on bevelled power semiconductor devices. Devices passivated by polyimide were also fabricated for comparison studies. The reverse current–voltage characteristic was studied at room temperature and high junction temperature. The differences arose from the remnant unbalance charges in the passivants as well as the varying dielectric strengths. Passivation materials applied to the beveled devices played a key role in achieving the targeted voltage. Results obtained indicated that the performance of power semiconductor devices passivated by SIPOS were superior to those passivated by polyimide, and SIPOS based process was effective and expected to enhance the reliability and yield.
Year
DOI
Venue
2005
10.1016/j.microrel.2004.10.005
Microelectronics Reliability
Keywords
Field
DocType
room temperature
Direct current,Polycrystalline silicon,Dielectric strength,Dielectric,Electronic engineering,Glow discharge,Engineering,Passivation,Semiconductor device,Junction temperature
Journal
Volume
Issue
ISSN
45
3
0026-2714
Citations 
PageRank 
References 
1
0.72
0
Authors
4
Name
Order
Citations
PageRank
Ying Wang139478.74
Chang-Chun Zhu276.83
Chunyu Wu311.40
Junhua Liu421.34