Name
Abstract | ||
|---|---|---|
In this paper, we investigate the crosstalk-induced delay and noise implications of floating and grounded fill metal generated using each of the rule-based and model-based fill placement techniques. We first examine the impact of fill metal on several interconnect test structures, which provide important insights into the performance and reliability implications of both intra-layer and inter-layer crosstalk coupling due to dummy fill. We then explore the noise and delay implications of fill metal on several large-scale designs implemented in 65 nm process technology. For the grounded fill cases, the fill metal significantly reduces crosstalk-induced delay and noise. Designs with floating fill also experience a reduction in average crosstalk-induced delay and noise, which is in contrast to the predictions of previous studies on small-scale interconnect structures. |
Year | DOI | Venue |
|---|---|---|
2008 | 10.1109/ISQED.2008.122 | San Jose, CA |
Keywords | Field | DocType |
dummy fill,average crosstalk-induced delay,noise implication,crosstalk-induced delay,inter-layer crosstalk coupling,fill metal,model-based fill placement technique,delay implication,fill case,important insight,testing,crosstalk,noise reduction,lithography,capacitance,design for manufacturability,design for manufacture,rule based | Coupling,Interconnect test,Crosstalk,Computer science,Electronic engineering,Interconnection,Electrical engineering,Design for manufacturability | Conference |
ISBN | Citations | PageRank |
978-0-7695-3117-5 | 2 | 0.39 |
References | Authors | |
16 | 3 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Arthur Nieuwoudt | 1 | 207 | 20.59 |
| Jamil Kawa | 2 | 108 | 12.33 |
| Yehia Massoud | 3 | 772 | 113.05 |