Name
Abstract | ||
|---|---|---|
Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving front high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed. |
Year | DOI | Venue |
|---|---|---|
2005 | 10.1093/ietele/e88-c.10.1939 | IEICE TRANSACTIONS ON ELECTRONICS |
Keywords | Field | DocType |
millimeter-wave, MMIC, module, automotive radar sensor, MCM, SiP, SoC, flip-chip | Flip chip,Extremely high frequency,Automotive radar,Electronic engineering,Monolithic microwave integrated circuit,Engineering,Electrical engineering | Journal |
Volume | Issue | ISSN |
E88C | 10 | 1745-1353 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
2 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yasushi Itoh | 1 | 0 | 1.35 |
| Kazuhiko Honjo | 2 | 12 | 11.55 |