Name
Abstract | ||
|---|---|---|
In this paper we present a tunable ultra-wideband LNA using system-in-package solution to enhance gain and noise performance. Several high-Q MEMS inductors are employed at the input matching network and the tunable resonator load. SiP integration is realized by Au-Au thermal compression bond of low electrical parasitic effects. It is found those inductors improve noise figure by 2 dB and help achieve gain flatness in a broad frequency range of 3-to 8-GHz. |
Year | DOI | Venue |
|---|---|---|
2006 | 10.1109/ICECS.2006.379966 | ICECS |
Keywords | Field | DocType |
high-q mems inductor,microwave amplifiers,system-in-package,low noise amplifiers,micromechanical resonators,matching network,frequency 3 ghz to 8 ghz,low-power electronics,system-in-package solution,low noise amplifier,sip technology,au-au thermal compression bond,uwb tunable lna design,low electrical parasitic effect,tunable resonator load,inductors,ultra wideband technology,system in package,low power electronics,noise figure,ultra wideband | System in package,Flatness (systems theory),Low-noise amplifier,Microelectromechanical systems,Computer science,Resonator,Noise figure,Inductor,Electronic engineering,Electrical engineering,Low-power electronics | Conference |
ISBN | Citations | PageRank |
1-4244-0395-2 | 0 | 0.34 |
References | Authors | |
2 | 5 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yang Chuan Chen | 1 | 0 | 0.34 |
| Chun-Hsing Li | 2 | 1 | 2.42 |
| J. K. Huang | 3 | 0 | 0.34 |
| Chien-Nan Kuo | 4 | 41 | 8.22 |
| Yu Ting Cheng | 5 | 63 | 6.39 |