Title
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn
Year
DOI
Venue
2003
10.1142/S1465876303001241
International Journal of Computational Engineering Science
Keywords
Field
DocType
qfn,accelerometer
Microelectromechanical systems,Quad Flat No-leads package,Accelerometer,Electronic engineering,Temperature cycling,Soldering,Engineering,Material properties
Journal
Volume
Issue
Citations 
4
2
1
PageRank 
References 
Authors
0.82
0
6
Name
Order
Citations
PageRank
Tong Yan Tee18427.45
Giovanni Frezza210.82
Mayhuan Lim310.82
Hun Shen Ng45621.96
Federico Ziglioli510.82
Zhao-Wei Zhong621236.01