Name
Abstract | ||
|---|---|---|
Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot mitigation schemes and thermal time constants, workload variations and microprocessor power distributions. By leveraging spatial and temporal heat slacks, our schemes enable lowering of on-chip unit temperatures by changing the workload in a timely manner with Operating System(OS) and existing hardware support. |
Year | DOI | Venue |
|---|---|---|
2007 | 10.1145/1283780.1283826 | ISLPED |
Keywords | Field | DocType |
temporal heat slack,power aware computing,on-chip reliability,adverse effect,scheduling,system software level,microprocessor chips,elevated on-chip temperatures,workload variation,operating system,linux,low-power design,current generation microprocessor design,logic design,microprocessor power distribution,microprocessor design,spatial hot spot mitigation,elevated on-chip temperature,repeater insertion,power-related issue,thermal-aware task scheduling,on-chip unit temperature,temperature-aware design,temperature measurement,hot spot,hardware,system on a chip,chip,heating,thermal management | Logic synthesis,System software,Hot spot (veterinary medicine),System on a chip,Scheduling (computing),Computer science,Workload,Microprocessor,Real-time computing,Electronic engineering,Repeater insertion,Embedded system | Conference |
ISBN | Citations | PageRank |
978-1-59593-709-4 | 96 | 3.45 |
References | Authors | |
20 | 6 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Jeonghwan Choi | 1 | 289 | 15.16 |
| Chen-Yong Cher | 2 | 770 | 39.92 |
| Hubertus Franke | 3 | 1257 | 104.86 |
| Henrdrik Hamann | 4 | 96 | 3.45 |
| Alan J Weger | 5 | 139 | 12.68 |
| Pradip Bose | 6 | 2790 | 210.58 |