Paper Info
Title
Numerical Analysis Of The Effect Of Thin-Film Thickness And Material In Field Mapping Of Eddy-Current Probes Using Photoinductive Technique
Abstract
Numerical analysis of the photoinductive (PI) field mapping technique for characterizing the eddy-current (EC) probes with tilted coils above a thin metal film was investigated using a two-dimensional transient finite element method (FEM). We apply the FEM model of PI method to observe the influence of metal film materials on the field-mapping images used to characterize EC probes. The effects of film thickness on the PI mapping signal are also shown and discussed. The simulation results using the proposed model showed that the PI signals largely depend on the thermal conductivity and the thickness of the thin metal film. The field-mapping signals using the appropriate actual metal film material for EC probe coil with 0 degrees, 5 degrees, 10 degrees, 15 degrees, and 20 degrees tilt angle are also examined. We demonstrate that the higher resolution in field-mapping images of commercial EC probes can be obtained by given higher thermal conductivity and thinner thickness of metal film. The fundamental understanding of distinct field distribution will aid in the selection of the higher-quality EC probe for accurate inspection with EC testing.
Year
DOI
Venue
2012
10.1587/transele.E95.C.86
IEICE TRANSACTIONS ON ELECTRONICS
Keywords
DocType
Volume
field mapping, finite element method (FEM), photoinductive image (PI), tilted coil
Journal
E95C
Issue
ISSN
Citations 
1
1745-1353
0
PageRank 
References 
Authors
0.34
2
3
Name
Order
Citations
PageRank
Yen-Lin Pan141.60
Cheng-Chi Tai285.43
Dong-shong Liang384.74